Product Details

LP-1200BSPD Dual Door PVD Evap/ Sputtering Coater

  • Model:LP-1200BSPD
  • Specification:

Product Introduction

Features:
  • Dual chamber for independent loading operations.
  • Four kinds of coating process modes available foe selection.
  • Option: RF generators or magnetron sputtering source can be installed for surface coating.
  • LP-BSD series uses planetary rotation mechanism to achieve good film uniformity on curved surface substrates.
 
Application:
  • Decorative items
  • Cellphone housing
  • NCVM applications
  • Metallic finish
System/Model
LP- 1200 BSPD
Chamber Size
 
Diameter
1,200 mm
Height
1,300 mm
Capacity
-
∮135x1,050 x18
Main Performance
Ultimate Pressure
Better than 10-6 Torr
Operation Pressure
From 1 atm to 5x10-5 Torr within 10 minutes (unloading)
View Windows
Set
1
Number of Filaments
Pcs
18~22
Pumping System
Rotary Pump
3,000~7,500 L/min
Booster Pump
1,200~1,500 M3/ hour
Diffusion Pump
20000 L/ sec
Holding Pump
300~600 L/min (Optional)
Meissner Trap
-110 ~ -140 ℃
Vacuum Gauge
 
Pirani (760 ~10-3 Torr); Cold Cathode (10-3 ~ 10-6 Torr)
Control Box
Set
1
Evaporation Power Supply
 
30KW
Sputtering Target
Pcs
2~4
Evaporation Power Supply
 
RF or DC
System Operation
 
Automatic/ Manual
Cooling water flow rate
 
80 L/min
High Vacuum Valve
 
24 inch
Roughing Valve
 
6 inch
Foreline Valve
 
6 inch
Leak Valve
 
2 inch
Holding Valve (option)
 
1 inch
Cooling Tower
 
15 RT (Water Pressure: 4kg/ cm2; Pressure Drop: 2kg/ cm2)
Cooling Water
 
Inlet: 18℃; Outlet: 25℃; Standard: 20±1℃
Polycold
 
Option
Air Compressor
 
3HP (Air Pressure: 6 ~ 8 kg/ cm2)
Electrical Control System
 
PLC
Total Power Requirement
 
75KW
Environment Requirement
Clean Room(ISO Class 5); Exopy Flooring; Air-conditioning; Temp.25±3℃; HUM50±10%